- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/322 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to modify their internal properties, e.g. to produce internal imperfections
Patent holdings for IPC class H01L 21/322
Total number of patents in this class: 890
10-year publication summary
82
|
97
|
73
|
68
|
72
|
65
|
51
|
38
|
45
|
13
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Sumco Corporation | 1116 |
108 |
Fuji Electric Co., Ltd. | 4750 |
87 |
Shin-Etsu Handotai Co., Ltd. | 1277 |
74 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
41 |
Globalwafers Co., Ltd. | 561 |
33 |
Soitec | 892 |
26 |
Infineon Technologies AG | 8189 |
25 |
Siltronic AG | 395 |
21 |
Applied Materials, Inc. | 16587 |
19 |
Micron Technology, Inc. | 24960 |
15 |
TOYOTA JIDOSHA KABUSHIKI KAISHA (also trading as TOYOTA MOTOR CORPORATION) | 13301 |
15 |
Disco Corporation | 1745 |
14 |
International Business Machines Corporation | 60644 |
13 |
Mitsubishi Electric Corporation | 43934 |
13 |
Globalwafers Japan Co., Ltd. | 62 |
13 |
Samsung Electronics Co., Ltd. | 131630 |
11 |
Infineon Technologies Austria AG | 1954 |
11 |
Tokyo Electron Limited | 11599 |
9 |
Texas Instruments Incorporated | 19376 |
8 |
Denso Corporation | 23338 |
8 |
Other owners | 326 |